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wafer    音标拼音: [w'efɚ]
n. 晶片,圆片,薄饼,干胶片
vt. 用干胶片封

晶片,圆片,薄饼,干胶片用干胶片封

wafer
晶片; 晶元; 圆片; 大晶片; 薄片; 干胶片

wafer


wafer
n 1: a small adhesive disk of paste; used to seal letters
2: a small thin crisp cake or cookie
3: thin disk of unleavened bread used in a religious service
(especially in the celebration of the Eucharist)

Wafer \Wa"fer\, n. [OE. wafre, OF. waufre, qaufre, F. qaufre; of
Teutonic origin; cf. LG. & D. wafel, G. waffel, Dan. vaffel,
Sw. v[*a]ffla; all akin to G. wabe a honeycomb, OHG. waba,
being named from the resemblance to a honeycomb. G. wabe is
probably akin to E. weave. See {Weave}, and cf. {Waffle},
{Gauffer}.]
[1913 Webster]
1. (Cookery) A thin cake made of flour and other ingredients.
[1913 Webster]

Wafers piping hot out of the gleed. --Chaucer.
[1913 Webster]

The curious work in pastry, the fine cakes, wafers,
and marchpanes. --Holland.
[1913 Webster]

A woman's oaths are wafers -- break with making --B.
Jonson.
[1913 Webster]

2. (Eccl.) A thin cake or piece of bread (commonly
unleavened, circular, and stamped with a crucifix or with
the sacred monogram) used in the Eucharist, as in the
Roman Catholic Church.
[1913 Webster]

3. An adhesive disk of dried paste, made of flour, gelatin,
isinglass, or the like, and coloring matter, -- used in
sealing letters and other documents.
[1913 Webster]

4. Any thin but rigid plate of solid material, esp. of
discoidal shape; -- a term used commonly to refer to the
thin slices of silicon used as starting material for the
manufacture of integrated circuits.
[PJC]

{Wafer cake}, a sweet, thin cake. --Shak.

{Wafer irons}, or {Wafer tongs} (Cookery), a pincher-shaped
contrivance, having flat plates, or blades, between which
wafers are baked.

{Wafer woman}, a woman who sold wafer cakes; also, one
employed in amorous intrigues. --Beau. & Fl.
[1913 Webster]


Wafer \Wa"fer\, v. t. [imp. & p. p. {Wafered}; p. pr. & vb. n.
{Wafering}.]
To seal or close with a wafer.
[1913 Webster]

91 Moby Thesaurus words for "wafer":
Brussels biscuit, Communion, Eucharist, Holy Communion, Host,
Last Supper, Melba toast, Sacrament Sunday, altar bread, biscuit,
bread, bread and wine, coat, coating, collop, consecrated bread,
consecrated elements, consubstantiation, covering, cracker, cut,
deal, disk, elements, feuille, film, flap, foil, fold,
graham cracker, gruel, hardtack, impanation, intinction, lamella,
lamina, laminated glass, laminated wood, lap, lath, leaf, loaf,
membrane, mere shadow, pane, panel, paper, patina, peel, pellicle,
pilot biscuit, plait, plank, plate, plating, ply, plywood, pretzel,
rail, rake, rasher, real presence, rusk, safety glass, saltine,
scum, sea biscuit, shadow, shaving, sheet, ship biscuit, sinker,
skeleton, skin, slab, slat, slice, slip, soda cracker, soup,
splinter, streak, subpanation, table, tablet, the Holy Sacrament,
the Sacrament, transubstantiation, vein, veneer, zwieback



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    二、半导体中名词“wafer”“chip”“die”的联系和区别 ①材料来源方面的区别 以硅工艺为例,一般把整片的硅片叫做wafer,通过工艺流程后每一个单元会被划片,封装。 在封装前的单个单元的裸片叫做die。 chip是对芯片的泛称,有时特指封装好的芯片。
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  • 什么是晶圆 (wafer)、晶粒 (die)以及芯片 (chip)?他们什么关系?
    晶圆(Wafer)-- 原材料和生产平台晶圆是半导体制造的基础材料,通常由高纯度的硅(Si)或其他半导体材料制成。 晶圆的形状一般是圆形的薄片,厚度一般在几百微米到几毫米之间,表面经过精密的处理,使其足够光滑,…
  • 半导体里的“披萨饼”:一文看懂Wafer、Die、Chip、Cell
    这张“披萨饼”在半导体行业里叫 Wafer(晶圆),它由高纯度硅制成,直径通常为8英寸或12英寸,是制造芯片的“地基”。 Wafer的制作过程: 原料:从沙子中提炼出高纯度硅,制成圆柱形硅锭。 切片:像切黄瓜一样将硅锭切成薄片,抛光后成为晶圆。
  • Wafer (electronics) - Wikipedia
    The wafer serves as the substrate for microelectronic devices built in and upon the wafer It undergoes many microfabrication processes, such as doping, ion implantation, etching, thin-film deposition of various materials, and photolithographic patterning
  • 晶圓 - 维基百科,自由的百科全书
    晶圓 經 蝕刻 (etch)製程處理後的晶圓 晶圆 (英語: Wafer)是半导体晶体圆形片的简称,其为圆柱状 半导体 晶体 的薄切片,用于 集成电路 制程中作为 载体 基片,以及制造 太阳能电池;由于其形状为圆形,故称为晶圆。
  • 什么是wafer(晶圆)? - 电子工程专辑 EE Times China
    什么是硅片或者晶圆? 硅片,英文名字为Wafer,也叫晶圆,是高纯度结晶硅的薄片。 硅晶圆作为芯片的基板,在制造电子电路中特别有用。 硅作为整个宇宙中最常见的元素排名第七,也是地球上第二常见的元素。 一些常见的含硅材料包括沙子、石英等。
  • 晶圆 (wafer) 晶粒 (die) 芯片 (chip)之间的区别是什么和芯片清洗剂介绍 - 合明科技
    晶圆 (wafer) 晶粒 (die) 芯片 (chip)之间的区别是什么和芯片清洗剂介绍 合明科技 发布时间:2024-11-25 👁 15640 Tags: 晶圆 晶粒 芯片
  • 晶圆 - 百度百科
    晶圆分为无图案晶圆(Bare Wafer)和图案晶圆(Patterned wafer),如图6所示。 考虑两种晶圆的缺陷类型的出发点有些不同。 晶圆表面的缺陷类型很多,既有可能是工艺产生也有可能材质本身的缺陷。 采用不同的 缺陷检测 方式,可能会对缺陷进行不同的划分。
  • Wafer | LLMs for enterprise
    Wafer’s Serverless endpoints follow the OpenAI Chat Completions schema, so existing clients — the OpenAI SDK, LangChain, LiteLLM, agent harnesses like Claude Code or Cline — work by swapping the base URL and API key





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